摘要：<div style="text-align:center;"> <h1 style="font:400 16px / 24px ui-sans-serif, system-ui, sans-serif, &quot;Apple Color Emoji&quot;, &quot;Segoe UI Emoji&quot;, &quot;Segoe UI Symbol&quot;, &quot;Noto Color Emoji&quot;;white-space:normal;flex:0 1 auto;flex-direction:row;justify-content:normal;align-items:normal;padding:0px;margin:0px;background-image:none;background-position:0% 0%;background-size:auto;background-repeat:repeat;background-attachment:scroll;background-origin:padding-box;background-clip:border-box;"> <span style="font-size:24px;">陶瓷芯片红外热成像检测</span> </h1> <p> <span style="font-size:24px;"><br /> </span> </p> <div style="font-style:normal;font-variant:normal;font-size-adjust:none;font-language-override:normal;font-kerning:auto;font-optical-sizing:auto;font-feature-settings:normal;font-variation-settings:normal;font-stretch:normal;font-family:ui-sans-serif, system-ui, sans-serif, &quot;Apple Color Emoji&quot;, &quot;Segoe UI Emoji&quot;, &quot;Segoe UI Symbol&quot;, &quot;Noto Color Emoji&quot;;font-size:16px;line-height:24px;white-space:normal;flex:0 1 auto;flex-direction:row;justify-content:normal;align-items:normal;padding:0px;margin:0px;background-image:none;background-position:0% 0%;background-size:auto;background-repeat:repeat;background-attachment:scroll;background-origin:padding-box;background-clip:border-box;"> </div> <p> 电子陶瓷芯片工作时产生的局部热点，会造成器件性能漂移甚至烧毁。红外热检测技术能够直观获取芯片表面温度场，判断芯片热分布是否均匀。 </p> <div style="font-style:normal;font-variant:normal;font-size-adjust:none;font-language-override:normal;font-kerning:auto;font-optical-sizing:auto;font-feature-settings:normal;font-variation-settings:normal;font-stretch:normal;font-family:ui-sans-serif, system-ui, sans-serif, &quot;Apple Color Emoji&quot;, &quot;Segoe UI Emoji&quot;, &quot;Segoe UI Symbol&quot;, &quot;Noto Color Emoji&quot;;line-height:24px;flex:0 1 auto;flex-direction:row;justify-content:normal;align-items:normal;padding:0px;margin:0px;background-image:none;background-position:0% 0%;background-size:auto;background-repeat:repeat;background-attachment:scroll;background-origin:padding-box;background-clip:border-box;"> </div> 在芯片研发与质量管控环节，借助 FOTRIC 红外热像仪，可以快速定位芯片内部热缺陷，分析热损耗，指导芯片材料与结构优化。 <div style="font-style:normal;font-variant:normal;font-size-adjust:none;font-language-override:normal;font-kerning:auto;font-optical-sizing:auto;font-feature-settings:normal;font-variation-settings:normal;font-stretch:normal;font-family:ui-sans-serif, system-ui, sans-serif, &quot;Apple Color Emoji&quot;, &quot;Segoe UI Emoji&quot;, &quot;Segoe UI Symbol&quot;, &quot;Noto Color Emoji&quot;;line-height:24px;flex:0 1 auto;flex-direction:row;justify-content:normal;align-items:normal;padding:0px;margin:0px;background-image:none;background-position:0% 0%;background-size:auto;background-repeat:repeat;background-attachment:scroll;background-origin:padding-box;background-clip:border-box;"> </div> <p> 整套检测属于非接触式无损检测，不会损伤被测样品，适合半导体陶瓷芯片研发实验、出厂可靠性测试。常用设备型号包含 Fotric 616C、626C、618C、628C。 </p> <p> <br /> </p> <p> <br /> </p> <iframe height="550" width="700" src="//player.bilibili.com/player.html?isOutside=true&aid=808412792&bvid=BV1G34y1q7dT&cid=492303745&p=1" scrolling="no" border="0" frameborder="no" framespacing="0" allowfullscreen="true"> </iframe> </div>